Acrosser New 2U IoT Rackmount Server

In response to the rising of artificial intelligence (AI), high-definition audio and video streaming and online live broadcast, data high-speed computing and transmission applications, Intel and AMD have launched a new generation of server platform products, including Intel’s next-generation Xeon® scalable processor family - Purley CPUs which are based on the Skylake-SP architecture and planned to replace the previous both Xeon® E5 and E7 processors powered by Broadwell microarchitecture.

Purley’s new platform combines multiple platform innovations and integrates performance enhancement technologies, including Intel AVX-512, Intel MESH architecture, Optane Solid State Drive (SSD), and Omni-Path Fabric fiber optic transmission technology. Purley’s new platform also supports existing and emerging data center and network workloads, including cloud computing, high-performance computing, and artificial intelligence, etc. The evolving data center and network infrastructure are designed to deliver the industry’s highest energy efficiency and system-level performance. Its average performance is 1.65 times higher than the previous generation. The performance of the Xeon® expandable processor is 2.2 times more efficient than the previous generation under the ever-increasing workload of artificial intelligence.

Acrosser Technology now is providing customers the Purley’s new platform network appliances, the Acrosser first 2U IoT Rackmount Server: ANR-C627/622N1. Positioned as powerful network appliances, ANR-C627/622N1 equipped with the latest generation Intel® Xeon® Scalable processors are perfect for IoT Gateway, Edge Computing (EC), Cloud, Next-Generation Firewall (NGFW), IPS/IDS, Security Gateway (Se-GW), Unified Threat Management (UTM) and Network Functions Virtualization (NFV). As excellence network appliances, ANR-C627/622N1 series support dual-socket Intel® Xeon® Scalable processors, 24* RDIMM/LRDIMM DDR4-2666, dual onboard SFP+ (10G fiber) and 8* Expandable Network Interface Modules (NIMs) for 1G/10G/40G (fiber/Copper/Bypass) various options. Strong networking ability can meet most of the enterprise-class customers’ needs.

Acrosser had committed its valuable resources to further develop its advanced network product lines. Furthermore, Acrosser is now working directly with Intel, as part of Intel IoT Solutions Alliance, in order to be able to offer its customers first-to-market services, the latest technologies, and solutions in a timely manner. As a member of the Intel IoT Solutions Alliance, Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.

For pricing and availability, please send your inquiry at http://www.acrosser.com/inquiry.html

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BIST for building ISO on-chip safety

Logic & Memory BIST
Functional safety standards for automotive chips like ASIL (Automotive Safety Integrity Level) recommend BIST (Built-In Self-Test) to be part of a chip. Before transitioning to functional mode, it goes through logic and memory-BIST to assure that the chip has not encountered any manufacturing or aging faults. Chips can implement BIST for critical modules like hardware monitors to detect any dormant faults. Chips can even implement a controller to control and manage the BIST operations.


Redundant critical on-chip modules like processor, ISO, DMA controller, internal clock generator, and communications peripherals can improve reliability should a primary hardware module become non-functional while the vehicle is running. Such a system can have in-built error detection mechanisms and on-the-fly switching to redundant hardware to mitigate threats to passenger safety.
But this kind of redundant hardware architecture comes with the penalty of increased area and higher power management in silicon. Area penalties can be minimized by intelligent selection of which functions need to be duplicated in silicon. Power can be minimized by adopting power and clock gating in the redundant modules. Some  in-vehicle computers can be implemented in lock-step of each other, where primary and redundant modules process the same input. Mismatch in the output of the lock-step modules indicates a defect in either of the modules. The system can switch itself off or take appropriate safety measures to avoid any real-time failure. Redundant hardware should be placed quite far in silicon from the primary embedded systems to avoid tampering of both modules together.

refer to: http://www.edn.com/design/automotive/4421704/Safety---security-architecture-for-automotive-ICs